Bridging the Processor-Memory Performance Gapwith 3D IC Technology 论文

2005IEEE Design & Test of Computers引用 282
DOI
VLSI and Analog Circuit TestingIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor materials and devices
VLSI and Analog Circuit TestingSemiconductor materials and devicesIntegrated Circuits and Semiconductor Failure Analysis
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Bridging the Processor-Memory Performance Gapwith 3D IC Technology · 作者

S

Sakshi Tiwari

M

Martin Burtscher

I

Ilya Ganusov

C

C.C. Liu