Improved three-step de-embedding method to accurately account for the influence of pad parasitics in silicon on-wafer RF test-structures 论文

2001IEEE Transactions on Electron Devices引用 256
DOI
Radio Frequency Integrated Circuit DesignVLSI and Analog Circuit TestingElectrostatic Discharge in Electronics
VLSI and Analog Circuit TestingRadio Frequency Integrated Circuit DesignElectrostatic Discharge in Electronics
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Improved three-step de-embedding method to accurately account for the influence of pad parasitics in silicon on-wafer RF test-structures · 作者

G

G. Van Dinther

D

Dominique Schreurs

E

E.P. Vandamme